Ceramic substrate material preparation

There are three main methods for forming ceramic substrates: compression molding, dry pressing and casting.

Casting is similar to spreading egg cakes. The thickness can be controlled by controlling the gap between the scraper and the base tape. It can be as thin as 10um or less and 1mm or more thick. This method is used in our ceramic circuit substrates;

The dry pressing method is similar to the metal powder metallurgy, which is put into a die for die casting, suitable for large pieces;

Compression molding is injection molding, which can be made into some structures with a slightly more complicated shape, such as injection molding for ceramic ferrules.