Black alumina ceramic substrates are mostly used in semiconductor integrated circuits and electronic products.

Alumina has many homogenous crystals, such as α-Al2o3, β-Al2o3, γ-Al2o3, etc. Among them, α-Al2o3 has higher stability, its crystal structure is compact, physical and chemical properties are stable, and it has density and mechanical properties. The advantage of higher strength has more applications in industry.

No need for high temperature sintering, no oxide generation, good adhesion of metal lines

ALN+N2→2ALN Put the aluminum powder into a reaction furnace filled with nitrogen and ammonia and heat it to 600°C to start the reaction.

There are three main methods for forming ceramic substrates: compression molding, dry pressing and casting.

Mechanical properties. Mechanical strength, can be used as a supporting member; good processing performance and high dimensional accuracy; smooth surface, no micro-cracks, bending, etc.

Aluminum nitride (AlN) is hexagonal, and pure AlN is blue-white, usually gray or off-white. As a new ceramic material with excellent comprehensive performance, aluminum nitride ceramics have excellent thermal conductivity, reliable electrical insulation, low dielectric constant and dielectric loss, non-toxic and thermal expansion coefficient matching silicon, etc. With excellent characteristics, it is considered an ideal material for a new generation of highly integrated semiconductor substrates and electronic device packaging.

The casting method refers to the manufacturing process of adding solvents, dispersants, binders, plasticizers and other substances to ceramic powder to make the slurry uniformly distributed, and then making ceramic sheets of different specifications on the casting machine.